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ED281DT

ED281DT

CONN IC DIP SOCKET 28POS TIN

Category

Mfr Part #

ED281DT

Life Cycle

Active

HSN Code

85369090

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 1479

Packaging Type

Tube

VendorPart#

ED3050-5-ND

Ware House

US Warehouse

HTS Code

8536694040

Date Code

Within 2 years

Min: 1
Mult: 1

Specifications

Contact Finish - Mating

Tin

Contact Finish - Post

Tin

Contact Finish Thickness - Mating

60.0µin (1.52µm)

Contact Finish Thickness - Post

60.0µin (1.52µm)

Contact Material - Mating

Phosphor Bronze

Contact Material - Post

Phosphor Bronze

Features

Open Frame

Housing Material

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type

Through Hole

Number of Positions or Pins (Grid)

28 (2 x 14)

Operating Temperature

-55°C ~ 110°C

Pitch - Mating

0.100" (2.54mm)

Pitch - Post

0.100" (2.54mm)

Termination

Solder

Type

DIP, 0.3" (7.62mm) Row Spacing