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BGAH325-075E

BGAH325-075E

Heat Sinks 32.5 x 32.5 x 7.5mm BGA Heatsink w/tape

Category

Mfr Part #

BGAH325-075E

Life Cycle

HSN Code

0000

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Suppliers

Mouser Electronics

Mouser Electronics

Stock : 79

Packaging Type

-

VendorPart#

588-BGAH325-075E

Ware House

US Warehouse

HTS Code

8542900000

Date Code

Within 2 years

Min: 1
Mult: 1

TME

TME

Stock : 0

Packaging Type

-

VendorPart#

BGAH325-075E

Factory Lead Time

0 Days

Ware House

Poland Warehouse

Date Code

Min: 100
Mult: 100

0

DigiKey Electronics

DigiKey Electronics

Stock : 2

Packaging Type

Box

VendorPart#

273-BGAH325-075E-ND

Ware House

US Warehouse

HTS Code

8473.30.5100

Date Code

Within 2 years

Min: 1
Mult: 1

Master Electronics

Master Electronics

Stock : 0

Packaging Type

-

VendorPart#

-

Factory Lead Time

29 Days

Ware House

US Warehouse

Date Code

Within 2 years

Min: 10
Mult: 10

0

Specifications

Attachment Method

Thermal Tape, Adhesive (Included)

Diameter

-

Fin Height

0.295" (7.50mm)

Length

1.279" (32.50mm)

Material

Aluminum Alloy

Material Finish

Black Anodized

Package Cooled

BGA, CPU, GPU

Packaging

Box

Part Status

Active

Power Dissipation @ Temperature Rise

-

Shape

Square, Angled Fins

Thermal Resistance @ Forced Air Flow

-

Thermal Resistance @ Natural

6.00°C/W

Type

Top Mount

Width

1.279" (32.50mm)