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4900P-250G

4900P-250G

Solder No Clean Lead Free Solder Paste, SAC305, 250g (8.81mL) JAR

Category

Mfr Part #

4900P-250G

Life Cycle

HSN Code

38101000

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 6

Packaging Type

Bulk

VendorPart#

4900P-250G-ND

Ware House

US Warehouse

HTS Code

8311303000

Date Code

Within 2 years

Min: 1
Mult: 1

Mouser Electronics

Mouser Electronics

Stock : 52

Packaging Type

-

VendorPart#

590-4900P-250G

Ware House

US Warehouse

HTS Code

3810100000

Date Code

Within 2 years

Min: 1
Mult: 1

Master Electronics

Master Electronics

Stock : 5

Packaging Type

-

VendorPart#

-

Ware House

US Warehouse

HTS Code

3810100000

Date Code

Within 2 years

Min: 1
Mult: 1

Specifications

Composition

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter

-

Flux Type

No-Clean

Form

Jar, 8.8 oz (250g)

Melting point

423 ~ 430°F (217 ~ 221°C)

Part Status

Active

Process

lead free

Shelf Life

24 Months

Shelf Life Start

Date of Manufacture

Storage/Refrigeration Temperature

35°F ~ 50°F (2°C ~ 10°C)

Type

Solder Paste

Wire Gauge

-