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2116564

2116564

Henkel Epoxy, Heat Cure, for Encapsulant Application, Syringe, LOCTITE Eccobond DP 1000 UA Series

Category

Mfr Part #

2116564

Life Cycle

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Suppliers

Mouser Electronics

Mouser Electronics

Stock : 0

Packaging Type

-

VendorPart#

298-2116564

Factory Lead Time

49 Days

Ware House

US Warehouse

Date Code

Within 2 years

Min: 13
Mult: 1

0