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BYG10D-AQ

BYG10D-AQ

Category

Mfr Part #

BYG10D-AQ

Life Cycle

New Product

HSN Code

00000000

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 0

Packaging Type

Bulk

VendorPart#

4878-BYG10D-AQ-ND

Factory Lead Time

0 Days

Ware House

US Warehouse

Date Code

Within 2 years

Min: 7500
Mult: 7500

0

Master Electronics

Master Electronics

Stock : 0

Packaging Type

-

VendorPart#

-

Factory Lead Time

9 Days

Ware House

US Warehouse

HTS Code

85411000

Date Code

Within 2 years

Min: 7500
Mult: 7500

0

TME

TME

Stock : 0

Packaging Type

-

VendorPart#

BYG10D-AQ-DIO

Factory Lead Time

0 Days

Ware House

Poland Warehouse

Date Code

Min: 1
Mult: 1

0

Mouser Electronics

Mouser Electronics

Stock : 0

Packaging Type

-

VendorPart#

637-BYG10D-AQ

Factory Lead Time

0 Days

Ware House

US Warehouse

HTS Code

0000000000

Date Code

Within 2 years

Min: 1
Mult: 1

0

Specifications

Application

automotive industry

Capacitance @ Vr, F

-

Case

SMA

Current - Average Rectified (Io)

1.5A

Current - Reverse Leakage @ Vr

5 µA @ 200 V

Features of semiconductor devices

avalanche breakdown effect

Grade

automotive

Kind of package

tape

Kind of package

reel

Leakage current

50µA

Load current

1.5A

Manufacturer

DIOTEC SEMICONDUCTOR

Max. forward impulse current

27A

Max. forward voltage

1.15V

Max. load current

5A

Max. off-state voltage

200V

Mounting

SMD

Mounting Type

Surface Mount

Operating Temperature - Junction

-50°C ~ 150°C

Package / Case

DO-214AC, SMA

Qualification

AEC-Q101

Reverse recovery time

1.5µs

Reverse Recovery Time (trr)

1.5 µs

Semiconductor structure

single diode

Speed

Standard Recovery >500ns, > 200mA (Io)

Supplier Device Package

DO-214AC (SMA)

Technology

Standard

Type of diode

rectifying

Voltage - DC Reverse (Vr) (Max)

200 V

Voltage - Forward (Vf) (Max) @ If

1.15 V @ 1.5 A