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Silicone encapsulating compound; grey; 0.25kg; -55÷260°C; 1.2MPa
Category
Encapsulating materials
Mfr Part #
QSIL553
Mfr
Life Cycle
HARDLY_AVAILABLE
HSN Code
0000
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Suppliers
TME
Packaging Type
-
VendorPart#
QSIL553/025
Factory Lead Time
0 Days
Ware House
Poland Warehouse
Date Code
0
two-component
thermally conductive
RTV curing
Silicone Rubber
sealing and tightening
7min
grey
3.41
18kV/mm
175%
UL94V-0
CHT
-55...260°C
3.26TΩm
32
1.2MPa
0.68W/mK
silicone encapsulating compound
0.25kg
1:1
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