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BGA0023

BGA0023

Mfr Part #

BGA0023

Life Cycle

HSN Code

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 4

Packaging Type

-

VendorPart#

BGA0023-ND

Ware House

US Warehouse

Date Code

Min: 1
Mult: 1

Specifications

Board Thickness

0.063" (1.60mm)

Manufacturer

Chip Quik Inc.

Material

FR4 Epoxy Glass

Number of Positions

100

Package Accepted

BGA

Packaging

Bulk

Part Status

Active

Pitch

0.016" (0.40mm)

Proto Board Type

SMD to PGA

Size / Dimension

1.900" x 1.900" (48.26mm x 48.26mm)