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375124B60024G

375124B60024G

HEATSINK BGA W/O SOLDER ANCHORS

Mfr Part #

375124B60024G

Life Cycle

Active

HSN Code

76169990

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 0

Packaging Type

Bulk

VendorPart#

HS332-ND

Factory Lead Time

0 Days

Ware House

US Warehouse

HTS Code

8473305100

Date Code

Within 2 years

Min: 672
Mult: 672

0

Specifications

Attachment Method

Solder Anchor

Diameter

-

Fin Height

0.984" (25.00mm)

Length

1.575" (40.00mm)

Material

Aluminum

Material Finish

Black Anodized

Package Cooled

BGA

Packaging

Bulk

Power Dissipation @ Temperature Rise

8.0W @ 80°C

Shape

Square, Pin Fins

Thermal Resistance @ Forced Air Flow

3.80°C/W @ 200 LFM

Thermal Resistance @ Natural

10.30°C/W

Type

Board Level

Width

1.575" (40.01mm)