Final Unit Price is calculated at the checkout is inclusive of Indian Customs Duty, International Freight, Insurance, Handling Fees and other charges

374424B00032G

374424B00032G

BGA HEAT SINK

Mfr Part #

374424B00032G

Life Cycle

Active

HSN Code

76169990

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 0

Packaging Type

Bulk

VendorPart#

374424B00032G-ND

Factory Lead Time

0 Days

Ware House

US Warehouse

HTS Code

8473305100

Date Code

Within 2 years

Min: 1080
Mult: 1080

0

Specifications

Attachment Method

Thermal Tape, Adhesive (Included)

Fin Height

0.710" (18.03mm)

Material

Aluminum

Material Finish

Black Anodized

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Packaging

Bulk

Power Dissipation @ Temperature Rise

4.0W @ 80°C

Thermal Resistance @ Forced Air Flow

5.00°C/W @ 350 LFM

Thermal Resistance @ Natural

20.30°C/W