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374224B60023G

374224B60023G

HEATSINK BGA W/O SOLDER ANCHORS

Mfr Part #

374224B60023G

Life Cycle

Active

HSN Code

0000

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Suppliers

DigiKey Electronics

DigiKey Electronics

Stock : 0

Packaging Type

Bulk

VendorPart#

HS329-ND

Factory Lead Time

0 Days

Ware House

US Warehouse

HTS Code

8473305100

Date Code

Within 2 years

Min: 1296
Mult: 1296

0

Specifications

Attachment Method

Solder Anchor

Diameter

-

Fin Height

0.984" (25.00mm)

Length

0.906" (23.01mm)

Material

Aluminum

Material Finish

Black Anodized

Package Cooled

BGA

Packaging

Bulk

Power Dissipation @ Temperature Rise

1.0W @ 20°C

Shape

Square, Pin Fins

Thermal Resistance @ Forced Air Flow

5.00°C/W @ 400 LFM

Thermal Resistance @ Natural

19.70°C/W

Type

Top Mount

Width

0.906" (23.01mm)