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ASFC32G31T3-51BIN

ASFC32G31T3-51BIN

eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

Category

Mfr Part #

ASFC32G31T3-51BIN

Life Cycle

New Product

HSN Code

85423100

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Suppliers

Element14

Element14

Stock : 0

Packaging Type

EACH

VendorPart#

4313440

Factory Lead Time

120 Days

Ware House

UK Warehouse

Date Code

Within 2 years

Min: 1
Mult: 1

0

TME

TME

Stock : 0

Packaging Type

-

VendorPart#

ASFC32G31T3-51BIN

Factory Lead Time

0 Days

Ware House

Poland Warehouse

Date Code

Min: 152
Mult: 152

0

DigiKey Electronics

DigiKey Electronics

Stock : 131

Packaging Type

Tray

VendorPart#

1450-ASFC32G31T3-51BIN-ND

Ware House

US Warehouse

HTS Code

8542320071

Date Code

Within 2 years

Min: 1
Mult: 1

Mouser Electronics

Mouser Electronics

Stock : 414

Packaging Type

-

VendorPart#

913-ASFC32G31T351BIN

Ware House

US Warehouse

HTS Code

8542320051

Date Code

Within 2 years

Min: 1
Mult: 1

Specifications

Case

FBGA153

Clock Frequency

200 MHz

Kind of interface

serial

Kind of memory

eMMC

Manufacturer

ALLIANCE MEMORY

Memory capacity

32GB

Memory Format

FLASH

Memory Interface

eMMC_5.1

Memory Organization

32G x 8

Memory Size

256Gbit

Memory Type

Non-Volatile

Mounting

SMD

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 85°C (TA)

Operating Temperature

-40...85°C

Operating voltage

2.7...3.6V

Package / Case

153-TFBGA

Packaging

Tray

Supplier Device Package

153-FBGA (11.5x13)

Technology

FLASH - NAND (TLC)

Type of integrated circuit

FLASH memory

Voltage - Supply

2.7V ~ 3.6V

Write Cycle Time - Word, Page

-